The PELCO® FlexScribe™

Precision Topside Scribing for all Materials

The PELCO^® FlexScribe™ (formerly from LatticeGear™) is a super-fast, simple method for downsizing wafers and samples by scribing on the topside. It uses a scribing wheel mounted to a sliding scribing mechanism that always makes a straight scribe. This system is used to scribe a wide variety of materials without restrictions on shape, including glass slides, coverslips, silicon, III-V, sapphire and other crystalline and brittle materials. It can address very small samples down to 5mm up to 200mm wafers for the #54340 model, and up to 300mm wafers for the #54342 model.

The standard tungsten carbide cutter installed on the PELCO^® FlexScribe™ is great for a wide variety of samples including silicon, glass, GaAs and other crystalline materials. Diamond and deep-cutting scribing wheels are also available.

Indenter recommendations:

#54346  Tungsten carbide scribing wheel is good for general purpose use.
#54343  Diamond cutter for very thin glass, tempered glass and hard materials such as sapphire.
#54344  Deep cutting wheel, for applications like thick glass or off-axis cleaving.

Application Examples

Break down wafers

Cleave strips and dies

Cleave off crystal axis

Cleave glass and Sapphire

Cut coupons for section cleaving

Cleave irregular shapes