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Silicon Specimen Supports

Silicon Specimen Supports

PELCO® Silicon Nitride Coated 3mm Disks (blanks)

21555-10

These 3mm silicon disks have a 50nm ultra low stress silicon nitride layer (Si3N4) on both sides and can be used as specimen disks for AFM applications which need a Si3N4 background. Provide smooth background: Surface roughness has RMS (Rg) of 0.65 ±0.06nm which gives a mean roughness (RA) of 0.45 ±0.02nm.

Product Specifications

  • Film thickness: 50nm ultra low stress Si3N4 on both sides
  • Disc thickness: 200µm silicon support
  • Disc diameter: 3mm
  • Surface roughness: The RMS (Rq) is 0.65 +/- 0.06nm which gives a mean roughness (Ra) of 0.45 +/- 0.02nm
  • Packaging: The PELCO® Silicon Aperture Frames are packaged under cleanroom conditions in the PELCO® #160 TEM Grid Storage box. Each box holds 10 discs.

MSDS (367KB PDF)


 

Silicon Chip Specimen Supports low background specimen supports for SEM viewing

16003, 16007, 16008, 16006, 16004, 16005

 

Silicon chips are opaque, of low electrical resistance and have surface properties equal to glass (including smoothness). They are also good substrates for growing or mounting cells. Silicon chips are precleaned before packaging. Also ideal for imaging small particles due to low background signal.
Availability: 4" wafer (#16010) is precut into 3 x 3mm, 5 x 7mmm, 5 x 5mm, 10 x 10mm, 20 x 20 mm or 20 x 30mm chips that can be easily separated in the laboratory.

  • 4" wafer precut into 3 x 3mm chips approximately 600 chips/wafer
  • 4" wafer precut into 5 x 7mm chips approximately 187 chips/wafer
  • 4" wafer precut into 5 x 5mm chips approximately 270 chips/wafer
  • 4" wafer precut into 10 x 10mm chips approximately 55 chips/wafer
  • 4" wafer precut into 20 x 20mm chips approximately 10 chips/wafer
  • 4" wafer precut into 20 x 30mm chips approximately 6 chips/wafer

Properties:

  • Orientation: <100>
  • Resistivity: 1-30 Ohm-cm
  • Type: P (Boron) (1 primary flat)
  • No SiO2 top coating
  • Wafer thickness: 18-21 mil (460-530µm)
  • Wafer is polished on one side
  • Roughness: 2nm
  • Before dicing they are rinsed in de-ionized water for cleaning


courtesy K.R. Peters
Peters, K.R., 1985. Working at higher magnifications in scanning electron microscopy with secondary and backscattered electrons on metal coated biological specimens and imaging macromolecular cell membrane structures. Scanning Electron Microscopy, IV:159.
Apkarian, R.P., High-resolution signal detection of specimen-specific secondary electrons in an analytical SEM, "Proc.. 44th Ann. Meeting of the EMSA", 1986, G.W. Bailey, Ed., San Francisco Press, 658 .


 

Documentation

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Variant Variant total Quantity Price Variant total
PELCO® Silicon Nitride 3mm Disks (Unit: pkg/10)21555-10
PELCO® Silicon Nitride 3mm Disks (Unit: pkg/10)21555-10
660,00 lei/ea
0,00 lei
660,00 lei/ea 0,00 lei
4" (10cm) dia., 3 x 3mm diced Silicon Wafer, 600 chips/wafer (Unit: each)16003
4" (10cm) dia., 3 x 3mm diced Silicon Wafer, 600 chips/wafer (Unit: each)16003
686,40 lei/ea
0,00 lei
686,40 lei/ea 0,00 lei
4" (10cm) dia., 5 x 7mm diced Silicon Wafer, 187 chips/wafer (Unit: each)16007
4" (10cm) dia., 5 x 7mm diced Silicon Wafer, 187 chips/wafer (Unit: each)16007
580,80 lei/ea
0,00 lei
580,80 lei/ea 0,00 lei
4" (10cm) dia., 5 x 5mm diced Silicon Wafer, 270 chips/wafer (Unit: each)16008
4" (10cm) dia., 5 x 5mm diced Silicon Wafer, 270 chips/wafer (Unit: each)16008
580,80 lei/ea
0,00 lei
580,80 lei/ea 0,00 lei
4" (10cm) dia., 10 x 10mm diced Silicon Wafer, 55 chips/wafer (Unit: each)16006
4" (10cm) dia., 10 x 10mm diced Silicon Wafer, 55 chips/wafer (Unit: each)16006
580,80 lei/ea
0,00 lei
580,80 lei/ea 0,00 lei
4" (10cm) dia., 20 x 20mm diced Silicon Wafer, 10 chips/wafer (Unit: each)16004
4" (10cm) dia., 20 x 20mm diced Silicon Wafer, 10 chips/wafer (Unit: each)16004
580,80 lei/ea
0,00 lei
580,80 lei/ea 0,00 lei
4" (10cm) dia., 20 x 30mm diced Silicon Wafer, 6 chips/wafer (Unit: each)16005
4" (10cm) dia., 20 x 30mm diced Silicon Wafer, 6 chips/wafer (Unit: each)16005
580,80 lei/ea
0,00 lei
580,80 lei/ea 0,00 lei

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