M-BOND™ 610 Adhesive

ion milling, cross-sectioning

This is a nonconductive, two-component, solvent-thinned, epoxy-phenolic adhesive for high performance applications. Chemically resistant and provides a thin layer of glue which has good ion milling properties. It has low viscosity and is extremely thin, with minimum creep, hysteresis and linearity problems. Solids content is 22%. It is an excellent adhesive for mounting samples for TEM dimpling and bonding of samples to TEM grids for imaging or FIB.

I - 16039 Adhesive SDS (173KB PDF)

I - 16039 Curing Agent SDS (167KB PDF)

Note: This product is hazardous. An extra shipping charge is required by the Carriers when hazardous goods are transported.