88150&88180 High Resolution Sputter Coater 208HRD with thickness controller MTM-20
The main features are:
Wide Choice of Coating Materials: Magnetron head design and effective gas handling allow a wide choice of target materials.
Precision Thickness Control: Thickness optimized using the MTM-20 high resolution thickness controller.
Multiple Sample Stage Movements: Separate rotary, planetary and tilting movements allow optimized coating distribution and coverage. (view RPT Stage)
Variable Chamber Geometry: Chamber geometry can be adjusted for coarse control of deposition rates.
Wide Range of Operating Pressures: Independent power/pressure adjustment allows operation at argon gas pressure ranges of 0.2 - 0.005 mbar.
Compact Modern Benchtop Design: Space and energy saving design eliminates need for floor space and specialized electrical connections.
R-P-T Stage with crystal head
208HRD-150 (model 88150) Turbo Sputter Coater for FE-SEM specific features:
Fixed magnetron sputter head with shutter
Ø150 chamber with height adjustment
Ø150 R-P-T stage with 4 planetary motion tables
Plasma voltage monitor
MTM-20 thickness control system
Electrically switched precision gas leak
Compound TMP ISO63 with cooling fan
Diaphragm backing pump 1.2/1.4 m3/hr
A Second Chamber Outfit for 208HRD-150 (87050) can be ordered separately if R-T or R-P-T stages are not necessary for specific applications. This part number includes: 1. Glass Chamber (∅150 x 150mm) 2. Metal Spacer (∅150 x 15mm) 3. Static Sample Table with height adjuster
NOTES: 1. Uses Ø28 sputter target with thickness 0.2 – 3.2. Target spacers are included. TARGET IS NOT INCLUDED 2. 4 x planetary tables are included. Pin stub tables are standard unless alternative tables are specified (see below) 3. Dry pump is standard unless alternative oil-filled rotary pump (2.5 m3/hr) is specified
208HRD-180 (model 88180) Turbo Sputter Coater for Thin Film R&D specific features:
Sliding/tilting magnetron sputter head with shutter
Ø180 Chamber with height adjustment
Ø180 R-T (rotary/tilting) stage with substrate table
Plasma voltage monitor
Penning high vacuum gauge
MTM-10 thickness monitor system
Electrically switched precision gas leak
Compound TMP ISO63 with cooling fan
Diaphragm backing pump 1.2/1.4 m3/hr
NOTES: 1. Uses Ø28 sputter target with thickness 0.2 – 3.2. Target spacers are included. TARGET IS NOT INCLUDED 2. ∅80mm table substrate table is included 3. Dry pump is standard unless alternative oil-filled rotary pump (2.5 m3/hr) is specified
SPECIFICATION
High resolution sputter coater
Chamber size
150mm Ø or 180mm Ø with variable height
Sputter head
Planar magnetron Shutter for target conditioning Wrap-around dark-space shield
Sputter target
28mm Ø, various materials
Sputter supply
Microprocessor based Safety interlocked Current control independent of vacuum Digitally selectable current (20, 40, 60 or 80mA)
Sample stage
Non-repetitive rotary planetary motion with manual tilt Variable speed rotation Crystal head 4 sample holders
Analogue metering
Vacuum, Atm - 0.001mb Current, 0 - 100mA
Control method
Automatic process sequencing Full manual override Automatic vent
The Cressington 208HRD now offers real solutions to the problems encountered when coating difficult samples for FE-SEM. In order to minimize the effects of grain size the 208HRD offers a full range of coating materials and gives unprecedented control over thickness and deposition conditions. To minimize charging effects the 208HRD stage design and wide range of operating pressures allows precise control of the uniformity and conformity of the coating.
