Graphite filled, conductive, compression mount material for hot embedding. Ideal for SEM, EDS/WDS and electro polishing applications. Hard embedding material with low electrical resistance and excellent edge retention. Enables imaging and analysis of clean, uncoated sample surfaces of conductive materials in the SEM, FESEM, EPMA or FIB systems.Hot embedding press is needed to use this embedding material. Embedding temperature 165°-200°C (330°-425°F) with a moulding pressure of 17-28 MPA (2500-4000 PSI). Typical curing time is 5-10 minutes.
Stainless Steel Tongs with serrated tips are ideal for handling hot embedded molds, hot items or small crucibles. Equally suitable for placing and retrieving embedded samples out of the ultrasonic cleaner. They can also be used for holder sample for immersion etching (light etching solutions only). Overall length 23cm (9").
Metal Spring Mounting Clips
813-210
Spring clips, ideal for holding thin samples for cross sectioning. Can be used for hot and cold embedding. Give additional support to facilitate flat grinding and polishing. Size is 6.3 x 120mm (W x L). Can be unrolled to hold a section with a thickness up to 40mm. Made of stainless steel.
Silicone Mold Release
813-206
This superior formulation of silicone mold release is particularly useful for easy release of cold or hot embedding molds. Cured resin embedding can be easily removed from plastic embedding mold when a thin layer of silicone mold release is sprayed on the inside of the mold. Apply a thin coat before loading sample and embedding powder (phenolic, Lucite, epoxy or diallyl phatalate) in hot embedding presses. Also prevents sticking of materials such as plastics, rubber and waxes to molds. Contains no CFC, HCFC or chlorinated solvents. Temperature Range: 40°F to 500°F (5°C to 260°C).