Polish and polishing compounds for metals, minerals, glass, ceramics, carbides and semiconductors
Diamond Paste Polishing Compound
For cleaning and polishing Diamond paste ready-packed for dispensing in syringes which are color-coded. Graded sizes and compounded for good dispersion. Exceeds US standards for purity, size and uniformity. Excellent cutting rates and provides a good smooth finish. Recommended for polishing various metals, alloys, minerals, glass, ceramics, carbides, semiconductors. Water soluble for easy clean up. Available in 5 and 18 gram syringes. Used on Polishing Cloths.
Set includes 5 sizes (5g syringes or 250ml pump sprays) each: 0.25µm, 0.5µm, 1µm, 3µm and 6µm.
Diamond Polishing Spray, ready for use in convenient spray bottle for direct application on polishing cloth. Same high quality diamond grades as used in the syringes.
The diamond extender fluid is used to dilute the diamond paste on polishing cloths to ensure even dispersion and more effective cutting action. Water-based, available in 1 pt. (473ml) and 1 gal. (3.78l)
High quality, fine graded Alumina suspension (water-based) for fine and end polishing of metallographic specimens. Reduces surface distortions and gives excellent polishing results. Can be used for analytical applications where diamond polishing is not suitable (analysis of carbon).
The polycrystalline is typically used on hard to polish materials such as ceramics, tool steels, sapphire, and super alloys. It has more facets or cutting edges and keeps its cutting ability by being less friable (easily crumbled or pulverized) than the more common and less costly monocrystalline diamonds. Monocrystalline diamonds tend to have longer, sharper edges and are more suitable for less hard materials such as brass or soft steel. Polycrystalline diamond is somewhat spherical in shape and it has a greater number of cutting facets than monocrystalline diamond, therefore reducing subsurface deformation, giving more precise results when surfaces are etched.
Polycrystalline Diamonds are typically used on hard materials such as ceramics, tool steel, sapphire, super alloys and Si. They have more cutting edges, are less fragile and cause less subsurface deformation. Water soluble, bottle of 250ml.
A non-crystallizing silica (SiO2) suspension stabilized at an alkaline pH value of 9.8. The combination of very fine abrasive particles in a chemically aggressive liquid provides a chemical-mechanical polishing action. Ideal for final polishing to obtain a deformation-free surface. Obtain excellent results on IC-cross sections, ceramics, minerals, hard steels and ductile non-ferrous materials. Recommended as final polishing for EBSD samples.
Supplied in 32 oz bottle (950ml) with a 40% particle concentration in water, pH range 9.7-9.9.
PELCO® Colloidal Silica Suspensions are ideal for the final polishing of materials for which a high quality, visibly scratch free surface is required. Three new formulations are provided, each with a specific average particle size and with increased alkalinity for an enhanced Chemical-Mechanical Polishing (CMP) effect.
PELCO® Colloidal Silica CS1 with an average particle size of 80nm and pH value of 9.9 is ideal for many metallographic final polishing applications. PELCO® Colloidal Silica CS2 with an average particle size of 50nm and pH value of 9.9 formulated for fine polishing of semiconductor wafers and devices. PELCO® Colloidal Silica CS3 with an average particle size of 35nm and pH value of 10.5 formulated specifically for fine polishing of silicon wafers and devices.
