The Omniprobe®Lift-Out Grids are specifically designed to accept the TEM lamellas milled out by FIB or SEM/FIB systems. Typical thickness of the grids is 25-30µm with a diameter of 3mm. The posts are designed for optimum access and provide a secure area for attaching (welding) the lamella(s). The Omniprobe®grids fit standard TEM holders and provide a non-obscured view of the thin sections attached to the posts.
Available in standard Cu with 3, 4 and 5 posts and in Mo with 3 posts. All Lift-Out Grids have multiple indexed mounting positions for easy identification and positioning in the TEM. Also thePELCO® FIB Liftout Gridsare available.
460-203, 460-2033, 460-223 Omniprobe® Lift-Out Grids with 3 posts
460-2031-S - Omniprobe® Lift-Out Grids, Cu with 3 posts and side access
460-204 - Omniprobe® Lift-Out Grids, Cu with 4 posts
460-205 - Omniprobe® Lift-Out Grids, Cu with 5 posts
460-206 - Omniprobe® Beryllium Half Ring Grids, Be