EPO-TEK® H70E Thermally Conductive Epoxy

EPO-TEK^® H70E is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. It is an excellent heat-sinking adhesive and is recommended for thermal management applications where good heat dissipation is needed. EPO-TEK^® H70E exhibits excellent handling characteristics and an extremely long pot life at room temperature. Easy to use; can be screen printed, machine dispensed, stamped or hand applied. Excellent adhesion to ferrous and non-ferrous metals, glass, ceramic, kovar and PCB. Can be cured very rapidly.

Cure Schedule (minimum bond temperature/time)
175ºC……..1 Minute
150ºC……..5 Minutes
120ºC..........15 Minutes
80ºC............90 Minutes

Properties (summary)

• Color : Grey / Beige
• Consistency: Slightly Pourable Paste
• Viscosity: 4,000 – 7,000 cps
• Thermal Conductivity: 0.9 W/mK
• Operating Temperature: -55ºC to 200ºC (-67ºF to 392ºF)
• Pot Life: 56 hours

Technical Notes, EPO-TEK® H70E Thermally Conductive Epoxy (135KB PDF)

Guide to working with Epoxies (2MB PDF)

Reworking Cured Epoxy (185KB PDF)

I - 16017 SDS (215KB PDF)

Note: This product is hazardous. An extra shipping charge is required by the Carriers when hazardous goods are transported.