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Diamond Sectioning & Wafering Blades

Diamond Sectioning & Wafering Blades

Diamond Sectioning / Wafering Blades

Can be used on all popular precision sectioning and cutting saws from PELCO®, Buehler, LECO, Struers, Allied and many others.

These competitively priced Smart Cut™ precision diamond wafering blades are designed to provide superior smooth surface quality, low-distortion sectioning and enhanced blade life. The man-made diamond crystals in the Smart Cut™ diamond sectioning blades / wafering blades are oriented in such a way that diamonds are only activated at the exposed layer. As the exposed layer begins to wear out, diamonds in a new layer are activated, keeping up the cutting rate.

The advantages are:

  • Faster cutting action – leaves smooth finish
  • Less glazing – requires minimal dressing
  • More universal – compatible with a greater variety of materials


All Smart Cut™ diamond blades have a metal bonded diamond height of 4mm and are available in 3, 4, 5 & 6" diameter with the industry standard 1/2" or 5/8" holes. Three grades are offered to fit most applications:

  • LC200MF medium/fine grit – low concentration for hard and tough materials, hard coating, hard ceramics and concrete ( equivalent to Buehler 15LC)
  • HC150MC medium/coarse grit - high concentration for composite materials, PCB, soft metals and bone (equivalent to Buehler 15HC)
  • HC320F fine grit – high concentration for glass fiber and carbon composites, soft ceramics and optical materials (equivalent to Buehler 5LC and 10LC)

Cutting Fluids & Dressing Sticks

The cutting fluids will assist in cooling the sample and disc during cutting operation. The cutting fluids will also remove cutting debris and reduce friction between cutting blade and sample.

Smart Cut Synthetic Water Soluble Cutting Fluid

812-648

The Smart Cut synthetic water soluble cutting fluid can be diluted 1:20 with water for cutting applications. Formulation is non-irritable, bio-resistant, easy to mix with water, and includes corrosion inhibitors.

SDS 120KB PDF

SO Type Cutting Fluid, Soluble Oil

812-650

The SO type water soluble oil cutting fluid can be diluted 1:40 with water for cutting applications. Anti-corrosive, bio-resistant formulation. Available in 1 quart and 1 gallon container.

MSDS 89KB PDF

Dressing Stick

812-420, 812-421

The dressing stick is used to expose the cutting diamonds, to improve cutting rate and to reduce heating at the cutting edge. Especially useful when cutting softer material where the cut material tends to "clog up" the cutting edge of the blade. Size is 12.5 x 12.5 x 152mm (0.49" x 0.49" x 5.98").

Documentation

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Variant Variant total Quantity Price Variant total
Diamond Wafering Blade, 3" x 0.015" x 1/2" hole, medium/fine grit - low concentration (Unit: each)812-310
Diamond Wafering Blade, 3" x 0.015" x 1/2" hole, medium/fine grit - low concentration (Unit: each)812-310
1.066,10 lei/ea
0,00 lei
1.066,10 lei/ea 0,00 lei
Diamond Wafering Blade, 3" x 0.015" x 1/2" hole, medium/coarse grit - high concentration (Unit: each)812-311
Diamond Wafering Blade, 3" x 0.015" x 1/2" hole, medium/coarse grit - high concentration (Unit: each)812-311
1.211,30 lei/ea
0,00 lei
1.211,30 lei/ea 0,00 lei
Diamond Wafering Blade, 3" x 0.015" x 1/2" hole, fine grit - high concentration (Unit: each)812-312
Diamond Wafering Blade, 3" x 0.015" x 1/2" hole, fine grit - high concentration (Unit: each)812-312
1.066,10 lei/ea
0,00 lei
1.066,10 lei/ea 0,00 lei
Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, medium/fine grit - low concentration (Unit: each)812-315
Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, medium/fine grit - low concentration (Unit: each)812-315
1.492,20 lei/ea
0,00 lei
1.492,20 lei/ea 0,00 lei
Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, medium/coarse grit - high concentration (Unit: each)812-316
Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, medium/coarse grit - high concentration (Unit: each)812-316
1.492,20 lei/ea
0,00 lei
1.492,20 lei/ea 0,00 lei
Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, fine grit - high concentration (Unit: each)812-317
Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, fine grit - high concentration (Unit: each)812-317
1.492,20 lei/ea
0,00 lei
1.492,20 lei/ea 0,00 lei
Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, medium/fine grit - low concentration (Unit: each)812-320
Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, medium/fine grit - low concentration (Unit: each)812-320
1.217,00 lei/ea
0,00 lei
1.217,00 lei/ea 0,00 lei
Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, medium/coarse grit - high concentration (Unit: each)812-321
Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, medium/coarse grit - high concentration (Unit: each)812-321
1.217,00 lei/ea
0,00 lei
1.217,00 lei/ea 0,00 lei
Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, fine grit - high concentration (Unit: each)812-324
Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, fine grit - high concentration (Unit: each)812-324
1.217,00 lei/ea
0,00 lei
1.217,00 lei/ea 0,00 lei
Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, medium/fine grit - low concentration (Unit: each)812-325
Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, medium/fine grit - low concentration (Unit: each)812-325
1.283,00 lei/ea
0,00 lei
1.283,00 lei/ea 0,00 lei
Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, medium/coarse grit - high concentration (Unit: each)812-326
Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, medium/coarse grit - high concentration (Unit: each)812-326
1.283,00 lei/ea
0,00 lei
1.283,00 lei/ea 0,00 lei
Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, fine grit - high concentration (Unit: each)812-327
Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, fine grit - high concentration (Unit: each)812-327
1.283,00 lei/ea
0,00 lei
1.283,00 lei/ea 0,00 lei
Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, medium/fine grit - low concentration (Unit: each)812-315-5
Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, medium/fine grit - low concentration (Unit: each)812-315-5
1.306,80 lei/ea
0,00 lei
1.306,80 lei/ea 0,00 lei
Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, medium/coarse grit - high concentration (Unit: each)812-316-5
Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, medium/coarse grit - high concentration (Unit: each)812-316-5
1.214,00 lei/ea
0,00 lei
1.214,00 lei/ea 0,00 lei
Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, fine grit - high concentration (Unit: each)812-317-5
Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, fine grit - high concentration (Unit: each)812-317-5
1.214,00 lei/ea
0,00 lei
1.214,00 lei/ea 0,00 lei
PELCO® Diamond Wafering Blade, 3 x 0.007 x 1/2" hole, fine grit/ high concentration, fully abrasive (Unit: each)812-328
PELCO® Diamond Wafering Blade, 3 x 0.007 x 1/2" hole, fine grit/ high concentration, fully abrasive (Unit: each)812-328
1.388,20 lei/ea
0,00 lei
1.388,20 lei/ea 0,00 lei
PELCO® Diamond Wafering Blade, 3 x 0.007 x 1/2" hole, medium grit/ high concentration, fully abrasive (Unit: each)812-329
PELCO® Diamond Wafering Blade, 3 x 0.007 x 1/2" hole, medium grit/ high concentration, fully abrasive (Unit: each)812-329
1.423,00 lei/ea
0,00 lei
1.423,00 lei/ea 0,00 lei
PELCO® Diamond Wafering Blade, 3 x 0.007 x 1/2" hole, medium grit/ low concentration, fully abrasive (Unit: each)812-330
PELCO® Diamond Wafering Blade, 3 x 0.007 x 1/2" hole, medium grit/ low concentration, fully abrasive (Unit: each)812-330
2.073,70 lei/ea
0,00 lei
2.073,70 lei/ea 0,00 lei
PELCO® Diamond Wafering Blade, 3 x 0.010 x 1/2" hole, medium grit/ high concentration, fully abrasive (Unit: each)812-331
PELCO® Diamond Wafering Blade, 3 x 0.010 x 1/2" hole, medium grit/ high concentration, fully abrasive (Unit: each)812-331
1.525,90 lei/ea
0,00 lei
1.525,90 lei/ea 0,00 lei
PELCO® Diamond Wafering Blade, 4 x 0.012 x 1/2" hole, fine grit/ high concentration, metal-bonded (Unit: each)812-332
PELCO® Diamond Wafering Blade, 4 x 0.012 x 1/2" hole, fine grit/ high concentration, metal-bonded (Unit: each)812-332
1.661,10 lei/ea
0,00 lei
1.661,10 lei/ea 0,00 lei
PELCO® Diamond Wafering Blade, 4 x 0.012 x 1/2" hole, medium grit/ high concentration, metal-bonded (Unit: each)812-333
PELCO® Diamond Wafering Blade, 4 x 0.012 x 1/2" hole, medium grit/ high concentration, metal-bonded (Unit: each)812-333
2.013,90 lei/ea
0,00 lei
2.013,90 lei/ea 0,00 lei
PELCO® Diamond Wafering Blade, 4 x 0.012 x 1/2" hole, coarse grit/ high concentration, metal-bonded (Unit: each)812-334
PELCO® Diamond Wafering Blade, 4 x 0.012 x 1/2" hole, coarse grit/ high concentration, metal-bonded (Unit: each)812-334
2.067,70 lei/ea
0,00 lei
2.067,70 lei/ea 0,00 lei
PELCO® Diamond Wafering Blade, 4 x 0.012 x 1/2" hole, coarse grit/ low concentration, metal-bonded (Unit: each)812-335
PELCO® Diamond Wafering Blade, 4 x 0.012 x 1/2" hole, coarse grit/ low concentration, metal-bonded (Unit: each)812-335
1.655,30 lei/ea
0,00 lei
1.655,30 lei/ea 0,00 lei
PELCO® Diamond Wafering Blade, 4 x 0.015 x 1/2" hole, fine grit/high concentration, metal-bonded (Unit: each)812-336
PELCO® Diamond Wafering Blade, 4 x 0.015 x 1/2" hole, fine grit/high concentration, metal-bonded (Unit: each)812-336
1.726,60 lei/ea
0,00 lei
1.726,60 lei/ea 0,00 lei
PELCO® Diamond Wafering Blade, 4 x 0.015 x 1/2" hole, medium grit/high concentration, metal-bonded (Unit: each)812-337
PELCO® Diamond Wafering Blade, 4 x 0.015 x 1/2" hole, medium grit/high concentration, metal-bonded (Unit: each)812-337
1.626,20 lei/ea
0,00 lei
1.626,20 lei/ea 0,00 lei
PELCO® Diamond Wafering Blade, 4 x 0.015 x 1/2" hole, coarse grit/high concentration, metal-bonded (Unit:each)812-338
PELCO® Diamond Wafering Blade, 4 x 0.015 x 1/2" hole, coarse grit/high concentration, metal-bonded (Unit:each)812-338
1.626,20 lei/ea
0,00 lei
1.626,20 lei/ea 0,00 lei
PELCO® Diamond Wafering Blade, 4 x 0.020 x 1/2" hole, fine grit/high concentration, metal-bonded (Unit: each)812-339
PELCO® Diamond Wafering Blade, 4 x 0.020 x 1/2" hole, fine grit/high concentration, metal-bonded (Unit: each)812-339
1.626,20 lei/ea
0,00 lei
1.626,20 lei/ea 0,00 lei
PELCO® Diamond Wafering Blade, 4 x 0.020 x 1/2" hole, medium grit/high concentration, metal-bonded (Unit: each)812-340
PELCO® Diamond Wafering Blade, 4 x 0.020 x 1/2" hole, medium grit/high concentration, metal-bonded (Unit: each)812-340
1.986,40 lei/ea
0,00 lei
1.986,40 lei/ea 0,00 lei
PELCO® Diamond Wafering Blade, 4 x 0.020 x 1/2" hole, coarse grit/high concentration, metal-bonded (Unit: each)812-341
PELCO® Diamond Wafering Blade, 4 x 0.020 x 1/2" hole, coarse grit/high concentration, metal-bonded (Unit: each)812-341
1.649,60 lei/ea
0,00 lei
1.649,60 lei/ea 0,00 lei
PELCO® Diamond Wafering Blade, 5 x 0.015 x 1/2" hole, medium grit/high concentration, metal-bonded (Unit: each)812-342
PELCO® Diamond Wafering Blade, 5 x 0.015 x 1/2" hole, medium grit/high concentration, metal-bonded (Unit: each)812-342
2.270,40 lei/ea
0,00 lei
2.270,40 lei/ea 0,00 lei
PELCO® Diamond Wafering Blade, 5 x 0.015 x 1/2" hole, coarse grit/high concentration, metal-bonded (Unit: each)12-343
PELCO® Diamond Wafering Blade, 5 x 0.015 x 1/2" hole, coarse grit/high concentration, metal-bonded (Unit: each)12-343
2.645,30 lei/ea
0,00 lei
2.645,30 lei/ea 0,00 lei
PELCO® Diamond Wafering Blade, 5 x 0.015 x 1/2" hole, coarse grit/low concentration, metal-bonded (Unit: each)812-344
PELCO® Diamond Wafering Blade, 5 x 0.015 x 1/2" hole, coarse grit/low concentration, metal-bonded (Unit: each)812-344
1.986,40 lei/ea
0,00 lei
1.986,40 lei/ea 0,00 lei
PELCO® Diamond Wafering Blade, 6 x 0.020 x 1/2" hole, coarse grit/high concentration, metal-bonded (Unit: each)812-345
PELCO® Diamond Wafering Blade, 6 x 0.020 x 1/2" hole, coarse grit/high concentration, metal-bonded (Unit: each)812-345
2.526,50 lei/ea
0,00 lei
2.526,50 lei/ea 0,00 lei
PELCO® Diamond Wafering Blade, 6 x 0.020 x 1/2" hole, coarse grit/low concentration, metal-bonded (Unit: each)812-346
PELCO® Diamond Wafering Blade, 6 x 0.020 x 1/2" hole, coarse grit/low concentration, metal-bonded (Unit: each)812-346
2.178,00 lei/ea
0,00 lei
2.178,00 lei/ea 0,00 lei
PELCO® Diamond Wafering Blade, 7 x 0.020 x 1/2" hole, medium grit/high concentration, metal-bonded (Unit: each)812-347
PELCO® Diamond Wafering Blade, 7 x 0.020 x 1/2" hole, medium grit/high concentration, metal-bonded (Unit: each)812-347
4.012,40 lei/ea
0,00 lei
4.012,40 lei/ea 0,00 lei
PELCO® Diamond Wafering Blade, 7 x 0.020 x 1/2" hole, coarse grit/high concentration, metal-bonded (Unit: each)812-348
PELCO® Diamond Wafering Blade, 7 x 0.020 x 1/2" hole, coarse grit/high concentration, metal-bonded (Unit: each)812-348
2.381,30 lei/ea
0,00 lei
2.381,30 lei/ea 0,00 lei
PELCO® Diamond Wafering Blade, 7 x 0.029 x 1/2" hole, coarse grit/high concentration, metal-bonded (Unit: each)812-349
PELCO® Diamond Wafering Blade, 7 x 0.029 x 1/2" hole, coarse grit/high concentration, metal-bonded (Unit: each)812-349
2.381,30 lei/ea
0,00 lei
2.381,30 lei/ea 0,00 lei
PELCO® cBN Wafering Blade, 3 x 0.006 x 1/2" hole, medium grit/high concentration, metal-bonded (Unit: each)812-355
PELCO® cBN Wafering Blade, 3 x 0.006 x 1/2" hole, medium grit/high concentration, metal-bonded (Unit: each)812-355
1.289,40 lei/ea
0,00 lei
1.289,40 lei/ea 0,00 lei
PELCO® cBN Wafering Blade, 4 x 0.012 x 1/2" hole, coarse grit/high concentration, metal-bonded (Unit: each)812-356
PELCO® cBN Wafering Blade, 4 x 0.012 x 1/2" hole, coarse grit/high concentration, metal-bonded (Unit: each)812-356
1.597,20 lei/ea
0,00 lei
1.597,20 lei/ea 0,00 lei
PELCO® cBN Wafering Blade, 4 x 0.012 x 1/2" hole, coarse grit/low concentration, metal-bonded (Unit: each)812-357
PELCO® cBN Wafering Blade, 4 x 0.012 x 1/2" hole, coarse grit/low concentration, metal-bonded (Unit: each)812-357
1.452,00 lei/ea
0,00 lei
1.452,00 lei/ea 0,00 lei
PELCO® cBN Wafering Blade, 5 x 0.015 x 1/2" hole, coarse grit/low concentration, metal-bonded (Unit: each)812-358
PELCO® cBN Wafering Blade, 5 x 0.015 x 1/2" hole, coarse grit/low concentration, metal-bonded (Unit: each)812-358
1.800,50 lei/ea
0,00 lei
1.800,50 lei/ea 0,00 lei
PELCO® cBN Wafering Blade, 6 x 0.020 x 1/2" hole, coarse grit/low concentration, metal-bonded (Unit: each)812-359
PELCO® cBN Wafering Blade, 6 x 0.020 x 1/2" hole, coarse grit/low concentration, metal-bonded (Unit: each)812-359
2.090,90 lei/ea
0,00 lei
2.090,90 lei/ea 0,00 lei
PELCO® cBN Wafering Blade, 7 x 0.025 x 1/2" hole, coarse grit/low concentration, metal-bonded (Unit: each)812-360
PELCO® cBN Wafering Blade, 7 x 0.025 x 1/2" hole, coarse grit/low concentration, metal-bonded (Unit: each)812-360
2.671,70 lei/ea
0,00 lei
2.671,70 lei/ea 0,00 lei
PELCO® SiC Abrasive Blade, 3 x 0.010 x 1/2" hole, medium grit812-361
PELCO® SiC Abrasive Blade, 3 x 0.010 x 1/2" hole, medium grit812-361
296,20 lei/ea
0,00 lei
296,20 lei/ea 0,00 lei
PELCO® SiC Abrasive Blade, 4 x 0.015 x 1/2" hole, medium grit (Unit: each)812-362
PELCO® SiC Abrasive Blade, 4 x 0.015 x 1/2" hole, medium grit (Unit: each)812-362
395,00 lei/ea
0,00 lei
395,00 lei/ea 0,00 lei
PELCO®Al2O3 Abrasive Blade, 4 x 0.015 x 1/2" hole, medium grit (Unit: each)812-363
PELCO®Al2O3 Abrasive Blade, 4 x 0.015 x 1/2" hole, medium grit (Unit: each)812-363
284,70 lei/ea
0,00 lei
284,70 lei/ea 0,00 lei
Smart Cut Cutting Fluid, water soluble concentrate (Unit: 1 quart = 946g)812-648
Smart Cut Cutting Fluid, water soluble concentrate (Unit: 1 quart = 946g)812-648
336,90 lei/ea
0,00 lei
336,90 lei/ea 0,00 lei
Smart Cut Cutting Fluid, water soluble concentrate ((Unit: 1 gallon = 3.78l)812-649
Smart Cut Cutting Fluid, water soluble concentrate ((Unit: 1 gallon = 3.78l)812-649
1.079,30 lei/ea
0,00 lei
1.079,30 lei/ea 0,00 lei
SO Cutting Fluid, Soluble Oil Concentrate (Unit: 1 quart = 946g)812-650
SO Cutting Fluid, Soluble Oil Concentrate (Unit: 1 quart = 946g)812-650
165,90 lei/ea
0,00 lei
165,90 lei/ea 0,00 lei
SO Cutting Fluid, Soluble Oil Concentrate (Unit: 1 gallon = 3.78l)812-653
SO Cutting Fluid, Soluble Oil Concentrate (Unit: 1 gallon = 3.78l)812-653
493,70 lei/ea
0,00 lei
493,70 lei/ea 0,00 lei
Dressing Sticks for Diamond Blades (Unit: each)812-420
Dressing Sticks for Diamond Blades (Unit: each)812-420
102,00 lei/ea
0,00 lei
102,00 lei/ea 0,00 lei
PELCO® Silicon Carbide Dressing Stick (Unit: each)812-421
PELCO® Silicon Carbide Dressing Stick (Unit: each)812-421
181,90 lei/ea
0,00 lei
181,90 lei/ea 0,00 lei

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