Crystalbond™ 509 bonds an advanced ceramic which is diced into 25-50 mil sections.
Wash away adhesives are ideal for temporary mounting of products that require dicing, polishing and other machining processes. They exhibit high bond strength and adhere readily to metals, glass and ceramics by melting with heat. When processing is complete, the adhesives are removed by reheating and cleaning with environmentally friendly cleaning agents.
Typical Applications:
machining advanced ceramics
lapping and polishing optical components
dicing ceramic substrates and semiconductor wafers
dicing ferrites, glasses and piezoelectrics
dicing metal and optical single crystals
mounting cross-sections for electron microscopy
backfilling components for temporary mechanical support
Crystalbond™ 509 Provides excellent adhesion and minimizes clogging of diamond tools compared to waxes. They are transparent in thin cross-sections. Soluble in acetone, odorless, non-flammable, biodegradable and may be rinsed in water.
Crystalbond™ 555 & 555-HMP A low melting point adhesive for moderate stress machining processes. It is transparent in thin cross-sections and is soluble in hot water. 555 has a Flow Point of 120ºF (54ºC); 555-HMP is 150ºF (66ºC);
Crystalbond™ 590 A high strength, resilient adhesive system, ideal for doing miniature and tall parts. It is soluble in methanol or IPA.